Product Description
It is used for dicing wafers used in semiconductor manufacture.
- Capable of dicing up to 150 mm dia. wafers.
- Air bearing spindle with an adjustable speed from 10 000 to 40 000 rpm.
- Power Requirement: 120V 50/60 Hz.
- Includes diamond blade currently installed
NOTE: It looks good under the hood. We powered it on, and it moved along all the axes, goes home, etc., and it appears that everything is working, but we're not set-up with air tanks, etc to further test it.
Selling As Removed from service, As-is.
