The Hex -pak utilizes the well proven HEXFET die, combining low on state resistance with high transconductance. These superior technology die are assembled by state of the art techniques into the TO-240package, feraturing 2.5kV rms isolation and solid M5  screw connections. The small footprint means the packaging is highly suited to power applications where space is a premium.

• High Current capability
• UL Recognised E78996
• Electrically Isolated Base Plate
• Easy Assembly into Equipment

MAXIMUM RATINGS

• Io @ Tc=25°- Continuos Drain Current: 150A Max
• Io @ Tc=100°C Continuous Drain Current: 120A Max
• Pulse Drain Current: 720A
• Pd @Tc =25°C Maximum Power Dissipation: 625W
• Gate to Source Voltage: 20V